We Have The Most Important Things Required To Succeed In Industry.
We Have SKILLED WORKFORCEHIGHEND MACHINERIESWORLDCLASS PLANT
Data Format Accepted :- Gerber, PDF, Autocad & Corel Draw
Solder Mask Over Bare Copper (SMOBC)
Tin Plating (Electroless / Electrolytic / Immersion)
Solder Mask : LPI & SR1000 (Red / Green / Blue)
Hot Air Solder Level (HASL)
Process Capabilities :- FR-1,FR-4,CEM-1,CEM-3, Glass Epoxy
A box of drill bits used for making holes in printed circuit boards. While tungsten-carbide bits are very hard, they eventually wear out or break. Drilling is a considerable part of the cost of a through-hole printed circuit board.
We are also equipped with excellon Mark IV,V,VI and Tru-drill 104/105 drilling machines. For small lots ,we utilize Alpha drilling machine. They feature auto-load and unload for lights off operation .These are excellent for prototypes due to their quick setup and unsurpassed speed.
DIRECT METALIZATION PROCESS
Our adoption of world class Shadow Process gives us an advantage in the industry because of its reliability, focus and perfection. Shadow-holes and other via conductive colloid 2 is an alkaline aqueous dispersion used to make through-holes and other via conductive for subsequent copper electroplating. Shadow process is environmentally advantageous as compared to other metallization process. Benefits include, no metal chelators, less rinse water usage and ease of operation.
VERTICAL FLASH LINE PLATING
The process gives perfection to copper build-up on the panels. With vertical synchronized and conveyorized movement with educator flooding system establish uniform copper plating on the holes and surface. This type of process adoption is for the first time in India.
Imaging is performed in clean room utilizing Mania Max 9000 exposure unit that is outfitted with automatic registration systems featuring vacuum hold-down with excellent registration capabilities. Room is temperature and humidity controlled.
State-of-the-art scoring equipment is used for fast, accurate V-grooving-Y tolerances are held to ±0.002”.with excellen Mark IV & Excel III CNC routing machines, perfection is achieved to match with customer's required boards individual parts of arrays from the control panel.
STRIP ETCH STRIP
From plating, the process panels travel to film strip, copper etch and tin stripping. PLC and in-process sensors provide excellent real time control of the process. First day film is stripped to expose unwanted copper on the panels. The tin is also then stripped and the copper is cleaned and prepared for solder mark application.
HORIZONTAL HOT AIR SOLDER LEVELLER
One of the first of its kind in India. Alchemy computer aided solder leveling is designed to achieve improved surface planarity, excellent solder distribution and finish. The reduced solder contact time and convection preheat reduces thermal shock and flux absorption. Computer aided process control gives high reliability and consistency of product. The system gives increased capacity with typical throughputs of 2000 panels per shift.
With a number of Mania ,L & M and U-Tron electrical test machines. M C P L make sure that each and every board are tested for high quality and trouble free .L & M machine with auto loader, un-loader and auto fixture filling capability gives reduction of man power and high accuracy testing of the boards. We have 70mil base gird testing capability. This will help us to deliver trouble free boards to out esteemed customers.
LPI SOLDER MASK
LPI is automated and processed utilizing DP-1000 and DP-1500 systems. We can process any process any types and color masks. This unit applies LPI ink with computer controlled squeegees, and then tack cures the in tunnel over preparing the panel for imaging.
SOLDER MASK DEVELOPING
Once the panel is exposed the panels are moved through IS make developer. PLC and in-process sensors givens excellent real-time process control and gives perfection to the developing of circuitry of customer's requirement.
AUTOMATIC PLATING SYSTEM
Copper/Tin plating is eductor based, allowing high aspect ratio plating with superior copper distribution characteristics and surface to hole ratios. High output rates coupled with low labor content is and added plus.